Quickcomputerstips
- What is CQFP package?
- What is QFP chip?
- What is difference between LQFP and TQFP?
- Which type of chip packaging includes a rectangular package with contacts on all four edges?
- What is SMD and BGA?
- What is CSP in semiconductor?
- What is a SMD IC?
- What does PLCC mean in electronics?
- What is SOP package in IC?
- What are IC packages made of?
- Why is IC packaging important?
- Which package type is chosen for military purposes?
- What is the disadvantage of integrated circuit?
What is CQFP package?
CQFP. CQFPs are hermetic packages consisting of true pieces of dry pressed ceramic surrounding a uniformed leadframe with tie bar attached. Lead counts for this package range from 28 to 240, with lead pitch ranging from 15.7mil to 50mils.
What is QFP chip?
A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common.
What is difference between LQFP and TQFP?
LQFP package having total height less than 1.7mm (including 1.7mm) and more than 1.2mm (no including 1.2mm), said package named Low profile Quad Flat Package. TQFP package having total height less than 1.2mm, said package named Thin profile Quad Flat Package.
Which type of chip packaging includes a rectangular package with contacts on all four edges?
A chip carrier is a rectangular package with contacts on all four edges. Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges.
What is SMD and BGA?
A ball grid array (BGA) is a type of surface-mount packaging. BGAs are used for integrated circuits, specifically for SMDs like microprocessors which require permanent mounting. ... It is used in high-efficiency devices as they are low cost, and offer convenient surface mounting with a high reliability.
What is CSP in semiconductor?
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package. Originally, CSP was the acronym for chip-size packaging. ... WL-CSP had been in development since 1990s, and several companies begun volume production in early 2000, such as Advanced Semiconductor Engineering (ASE).
What is a SMD IC?
SMD IC. ... Surface-mount technology is a method for constructing electronic circuits in which the components are mounted directly onto the surface of printed circuit boards (PCBs). Offered product is available on different specifications keeping in sync with needs of customers.
What does PLCC mean in electronics?
(Plastic Leaded Chip Carrier) A plastic, square, surface mount chip package that contains leads on all four sides.
What is SOP package in IC?
Small Out-Line Package IC
Also refer to a PSOP, a plastic SOP, again a much smaller IC with fewer pins. The term Small-Outline normally just means that the package is thinner than a pre-existing package style. The term doesn't define the type of leads or terminals used with the package.
What are IC packages made of?
The materials of the package are either plastic (thermoset or thermoplastic), metal (commonly Kovar) or ceramic. A common plastic used for this is epoxy-cresol-novolak (ECN). All three material types offer usable mechanical strength, moisture and heat resistance.
Why is IC packaging important?
IC packaging is the ability to provide more and more I/O interconnections to a die (bare chip) that is increasingly shrinking in size is an ever-present problem. ... This will imposes challenges for new 3D integration that requires innovative packaging technologies [1].
Which package type is chosen for military purposes?
Which package type is chosen for military purposes? Explanation: Ceramic DIP can be used for high temperature and high performance equipment. Explanation: A Dual-In-Line Package is usually referred to as DIPn.
What is the disadvantage of integrated circuit?
Disadvantages of ICs:
If one component in an integrated circuits fails, it means the whole circuit has to be replaced. It is difficult to be achieved low-temperature coefficient. It can be handled an only a limited amount of power. Coils or indicators cannot be fabricated.
